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Automatic Laser Edge Isolation
[Time:2012-03-16 Browsing times:2676]
Laser Edge Isolation
plication: Laser edge isolation by laser grooving.
Specification：
Wafer size: 125mm×125mm/156mm×156mm
High throughput of up to1,500 wafer/h
CCD vision system for automatic alignment；
Low breakage rates
Available as inline or stand-alone system
For more details, please contact dr@drlaser.com.cn; 86-27-87922379.
